Method for manufacturing semiconductor structure

ABSTRACT

A method for manufacturing a semiconductor structure includes forming a first dielectric layer on a gate structure and a source drain structure. A recess is formed at least partially in the first dielectric layer. A protection layer is formed at least on a sidewall of the recess. The recess is deepened to expose the source drain structure. A bottom conductor is formed in the recess and is electrically connected to the source drain structure. The protection layer is removed to form a gap between the bottom conductor and the sidewall of the recess.

RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.15/051,619, filed on Feb. 23, 2016, now U.S. Pat. No. 9,716,154, whichclaims priority to U.S. provisional application Ser. No. 62/269,032,filed on Dec. 17, 2015. All of these applications are incorporatedherein by reference in their entireties.

BACKGROUND

Semiconductor devices are used in a variety of electronic applications,such as personal computers, cell phones, digital cameras, and otherelectronic equipment, as examples. The semiconductor industry continuesto improve the integration density of various electronic components(e.g., transistors, diodes, resistors, capacitors, etc.) by continualreductions in minimum feature size, which allow more components to beintegrated into a given area.

The word “interconnection” in integrated circuits means conductive lineswhich connect the various electronic components. The interconnectingconductive lines are separated from the substrate by insulating layers,except on the contact area. As feature densities increase, the widths ofthe conductive lines and the spacing between the conductive lines ofinterconnect structures also scale smaller.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1-11 are cross-sectional views of a method for manufacturing asemiconductor structure at various stages in accordance with someembodiments of the present disclosure.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the provided subjectmatter. Specific examples of components and arrangements are describedbelow to simplify the present disclosure. These are, of course, merelyexamples and are not intended to be limiting. For example, the formationof a first feature over or on a second feature in the description thatfollows may include embodiments in which the first and second featuresare formed in direct contact, and may also include embodiments in whichadditional features may be formed between the first and second features,such that the first and second features may not be in direct contact. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.

Further, spatially relative terms, such as “beneath,” “below,” “lower,”“above,” “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. The spatiallyrelative terms are intended to encompass different orientations of thedevice in use or operation in addition to the orientation depicted inthe figures. The apparatus may be otherwise oriented (rotated 90 degreesor at other orientations) and the spatially relative descriptors usedherein may likewise be interpreted accordingly.

The singular forms “a”, “an” and “the” are intended to include theplural forms as well, unless the context clearly indicates otherwise. Itwill be further understood that the terms “comprises” and/or“comprising”, or “includes” and/or “including” or “has” and/or “having”when used in this specification, specify the presence of statedfeatures, regions, integers, steps, operations, elements, and/orcomponents, but do not preclude the presence or addition of one or moreother features, regions, integers, steps, operations, elements,components, and/or groups thereof.

It will be understood that when an element is referred to as being “on”another element, it can be directly on the other element or interveningelements may be present therebetween. In contrast, when an element isreferred to as being “directly on” another element, there are nointervening elements present. As used herein, the term “and/or” includesany and all combinations of one or more of the associated listed items.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by theperson having ordinary skill in the art. It will be further understoodthat terms, such as those defined in commonly used dictionaries, shouldbe interpreted as having a meaning that is consistent with their meaningin the context of the relevant art and the present disclosure, and willnot be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

FIGS. 1-11 are cross-sectional views of a method for manufacturing asemiconductor structure at various stages in accordance with someembodiments of the present disclosure.

Reference is made to FIG. 1. A semiconductor structure is formed. Thesemiconductor structure includes a substrate 110, gate structures 121and 123, and at least one source drain structure 130. The gatestructures 121 and 123 are respectively present on the substrate 110.The source drain structure 130 is present on the substrate 110 andadjacent to the gate structures 121 and 123. In other words, the sourcedrain structure 130 is present between the gate structures 121 and 123.It is note that the numbers of the gate structures 121 and 123 and thenumber of the source drain structure 130 are illustrative and should notlimit various embodiments of the present disclosure. A person havingordinary skill in the art may select suitable numbers for the gatestructures 121 and 123 and the source drain structure 130 according toactual situations.

In some embodiments, the substrate 110 may be made of a semiconductormaterial and may include, for example, a graded layer or a buried oxidetherein. In some embodiments, the substrate 110 includes bulk siliconthat may be undoped or doped (e.g., p-type, n-type, or combinationsthereof). Other materials that are suitable for semiconductor deviceformation may be used. For example, germanium, quartz, sapphire, andglass could alternatively be used for the substrate 110. Alternatively,the substrate 110 may be an active layer of a semiconductor-on-insulator(SOI) substrate or a multi-layered structure, such as asilicon-germanium layer formed on a bulk silicon layer.

In some embodiments, at least one stack of a gate dielectric layer, adiffusion barrier layer, a metal layer, a block layer, a wetting layer,and filling metal form at least one of the gate structures 121 and 123.In other words, at least one of the gate structures 121 and 123 mayinclude the stack of the gate dielectric layer, the diffusion barrierlayer, the metal layer, the block layer, the wetting layer, and thefilling metal.

In some embodiments, the gate dielectric layer includes an interfaciallayer (IL, the lower part of the gate dielectric layer), which is adielectric layer. In some embodiments, the IL includes an oxide layer,such as a silicon oxide layer, which may be formed through a thermaloxidation of the substrate 110, a chemical oxidation, or a depositionstep. The gate dielectric layer may also include a high-k dielectriclayer (the upper part of the gate dielectric layer) including a high-kdielectric material, such as hafnium oxide, lanthanum oxide, aluminumoxide, or combinations thereof. The dielectric constant (k-value) of thehigh-k dielectric material is higher than about 3.9, and may be higherthan about 7, and sometimes as high as about 21 or higher. The high-kdielectric layer is overlying, and may contact, the IL.

In some embodiments, the diffusion barrier layer includes TiN, TaN, orcombinations thereof. For example, the diffusion barrier layer mayinclude a TiN layer (the lower part of the diffusion barrier layer), anda TaN layer (the upper part of the diffusion barrier layer) over the TiNlayer.

When one of the gate structures 121 and 123 forms an n-typemetal-oxide-semiconductor (MOS) device, the metal layer is in contactwith the diffusion barrier layer. For example, in the embodiments inwhich the diffusion barrier layer includes a TiN layer and a TaN layer,the metal layer may be in physical contact with the TaN layer. Inalternative embodiments in which one of the gate structures 121 and 123forms a p-type MOS device, an additional TiN layer is formed between,and in contact with, the TaN layer (in the diffusion barrier layer) andthe overlaying metal layer. The additional TiN layer provides the workfunction suitable for the pMOS device, which work function is higherthan the mid-gap work function (about 4.5 eV) that is in the middle ofthe valance band and the conduction band of silicon. The work functionhigher than the mid-gap work function is referred to as a p-workfunction, and the respective metal having the p-work function isreferred to as a p-metal.

The metal layer provides the work function suitable for the nMOS device,which work function is lower than the mid-gap work function. The workfunction lower than the mid-gap work function is referred to as ann-work function, and the respective metal having the n-work function maybe referred to as an n-metal. In some embodiments, the metal layer is ann-metal having a work function lower than about 4.3 eV. The workfunction of the metal layer may also be in a range from about 3.8 eV toabout 4.6 eV. The metal layer may include titanium aluminum (TiAl)(which may include, or free from or substantially free from otherelements) in accordance with some embodiments. The formation of themetal layer may be achieved through physical vapor deposition (PVD). Inaccordance with some embodiments of the present disclosure, the metallayer is formed at room temperature (for example, from about 20° C. toabout 25° C.). In alternative embodiments, the metal layer is formed atan elevated temperature higher than the room temperature, for example,higher than about 200° C.

The block layer may include TiN in some embodiments. The block layer maybe formed using atomic layer deposition (ALD).

The wetting layer has an ability to adhere (and wet) the subsequentlyformed filling metal during the reflow of the filling metal. In someembodiments, the wetting layer is a cobalt layer, which may be formedusing atomic layer deposition (ALD) or chemical vapor deposition (CVD).

The filling metal may include aluminum, an aluminum alloy (e.g.,titanium aluminum), tungsten, or copper, which may also be formed usingphysical vapor deposition (PVD), chemical vapor deposition (CVD), or thelike. The filling metal may be reflowed. The formation of the wettinglayer improves the wetting of the filling metal to the underlyinglayers.

The source drain structure 130 may be formed by doping impurities intoat least one active semiconductor fin, which is formed by, for example,patterning and etching the substrate 110 using photolithographytechniques. In some embodiments that the resulting MOS device is an nMOSdevice, n-type impurities such as phosphorous or arsenic may be doped inthe source drain structure 130. In some other embodiments that theresulting MOS device is a pMOS device, p-type impurities such as boronor BF₂ may be doped in the source drain structure 130.

Alternatively, the source drain structure 130 may be formed by, forexample, epitaxial growth. In these embodiments, the source drainstructure 130 may function as a source drain stressor to enhance carriermobility of the semiconductor device and the device performance. Thesource drain structure 130 may be formed using a cyclic deposition andetching (CDE) process. The CDE process includes an epitaxialdeposition/partial etch process and repeating the epitaxialdeposition/partial etch process at least once.

In some embodiments that the resulting MOS device is an nMOS device, thesource drain structure 130 may be an n-type epitaxy structure. In someembodiments that the resulting MOS device is a pMOS device, the sourcedrain structure 130 may be a p-type epitaxy structure. The n-typeepitaxy structure may be made of SiP, SiC, SiPC, Si, III-V compoundsemiconductor materials or combinations thereof, and the p-type epitaxystructure may be made of SiGe, SiGeC, Ge, Si, III-V compoundsemiconductor materials, or combinations thereof. During the formationof the n-type epitaxy structure, n-type impurities such as phosphorousor arsenic may be doped with the proceeding of the epitaxy. For example,when the n-type epitaxy structure include SiP or SiC, n-type impuritiesare doped. Moreover, during the formation of the p-type epitaxystructure, p-type impurities such as boron or BF₂ may be doped with theproceeding of the epitaxy. For example, when the p-type epitaxystructure includes SiGe, p-type impurities are doped. The epitaxyprocesses include CVD deposition techniques (e.g., vapor-phase epitaxy(VPE) and/or ultra-high vacuum CVD (UHV-CVD)), molecular beam epitaxy,and/or other suitable processes. The source drain structure 130 may bein-situ doped. If the source drain structure 130 is not in-situ doped, asecond implantation process (i.e., a junction implant process) isperformed to dope the source drain structure 130. One or more annealingprocesses may be performed to activate the source drain structure 130.The annealing processes include rapid thermal annealing (RTA) and/orlaser annealing processes.

In addition, spacers 141 are present on sidewalls of the gate structure121, and spacers 143 are present on sidewalls of the gate structure 123.In some embodiments, at least one of the spacers 141 and 143 include oneor more layers, including silicon nitride, silicon oxynitride, siliconoxide, or other dielectric materials. The available formation methodsinclude plasma enhanced chemical vapor deposition (PECVD), low-pressurechemical vapor deposition (LPCVD), sub-atmospheric chemical vapordeposition (SACVD), and other deposition methods.

Moreover, a hard mask layer 145 is present on a top surface of the gatestructure 121, and a hard mask layer 147 is present on a top surface ofthe gate structure 123. The hard mask layers 145 and 147 may include,for example, silicon nitride or the like. The hard mask layers 145 and147 may be formed using chemical vapor deposition (CVD), physical vapordeposition (PVD), atomic layer deposition (ALD), other suitableprocesses, or combinations thereof.

Then, a dielectric layer 150 is formed on the gate structures 121 and123 and the source drain structure 130. The dielectric layer 150 is aninterlayer dielectric (ILD) layer. The dielectric layer 150 is made of adielectric material, such as silicon oxide, silicon nitride, siliconoxynitride, or combinations thereof. In some embodiments, the dielectriclayer 150 is made of a low-κ dielectric material to improveresistive-capacitive (RC) delay. The dielectric constant of the low-κdielectric material is lower than that of silicon dioxide (SiO₂). Oneapproach to reduce the dielectric constant of a dielectric material isto introduce carbon (C) or fluorine (F) atoms. For example, in SiO₂(κ=3.9), the introduction of C atoms to form hydrogenated carbon-dopedsilicon oxide (SiCOH) (κ is between 2.7 and 3.3) and the introduction ofF atoms to form fluorosilicate glass (FSG) (κ is between 3.5 and 3.9)reduces its dielectric constant. In some embodiments, the low-κdielectric material is, for example, nanopore carbon doped oxide (CDO),black diamond (BD), a benzocyclobutene (BCB) based polymer, an aromatic(hydrocarbon) thermosetting polymer (ATP), hydrogen silsesquioxane(HSQ), methyl silsesquioxane (MSQ), poly-arylene ethers (PAE),diamond-like carbon (DLC) doped with nitrogen, or combinations thereof.The dielectric layer 150 is formed by, for example, chemical vapordeposition (CVD), spin coating, or combinations thereof.

Reference is made to FIG. 2. A recess 151 is formed at least partiallyin the dielectric layer 150 to expose at least a portion of at least oneof the spacers 141 and 143, while a portion of the dielectric layer 150(the dielectric layer 150 d) is left on the source drain structure 130,in which the dielectric layer 150 d is present adjacent to the spacers141 and 143 and between the spacers 141 and 143. The recess 151 isformed by a photolithography and etching process. The photolithographyand etching process includes photoresist application, exposure,developing, etching, and photoresist removal. A photoresist is appliedonto the dielectric layer 150 by, for example, spin coating. Thephotoresist is then prebaked to drive off excess photoresist solvent.After prebaking, the photoresist is exposed to a pattern of intenselight.

The intense light is, for example, a G-line with a wavelength of about436 nm, an I-line with a wavelength of about 365 nm, a krypton fluoride(KrF) excimer laser with a wavelength of about 248 nm, an argon fluoride(ArF) excimer laser with a wavelength of about 193 nm, a fluoride (F₂)excimer laser with a wavelength of about 157 nm, or combinationsthereof. A space between the final lens of the exposure tool and thephotoresist surface may be filled with a liquid medium that has arefractive index greater than one during the exposure to enhance thephotolithography resolution. The exposure to light causes a chemicalchange that allows some of the photoresist soluble in a photographicdeveloper.

Then, a post-exposure bake (PEB) may be performed before developing tohelp reduce standing wave phenomena caused by the destructive andconstructive interference patterns of the incident light. Thephotographic developer is then applied onto the photoresist to removethe some of the photoresist soluble in the photographic developer. Theremaining photoresist is then hard-baked to solidify the remainingphotoresist.

At least one portion of the dielectric layer 150 which is not protectedby the remaining photoresist is etched to form the recess 151. Theetching of the dielectric layer 150 may be dry etching, such as reactiveion etching (RIE), plasma enhanced (PE) etching, or inductively coupledplasma (ICP) etching. In some embodiments, when the dielectric layer 150is made of silicon oxide, fluorine-based RIE can be used to form therecess 151. The gas etchant used to dry etch the dielectric layer 150is, for example, CF₄/O₂.

After the recess 151 is formed, the photoresist is removed from thedielectric layer 150 by, for example, plasma ashing, stripping, orcombinations thereof. Plasma ashing uses a plasma source to generate amonatomic reactive species, such as oxygen or fluorine. The reactivespecies combines with the photoresist to form ash which is removed witha vacuum pump. Stripping uses a photoresist stripper, such as acetone ora phenol solvent, to remove the photoresist from the dielectric layer150.

Reference is made to FIG. 3. A protection layer 160 is formed on a topsurface of portions of the dielectric layer 150 (the dielectric layer150 u) on or above the gate structures 121 and 123 (or, on or above thehard mask layers 145 and 147), at least one sidewall of the recess 151(i.e., at least one sidewall of the dielectric layer 150 u and at leasta portion of the exposed spacers 141 and 143), and a bottom surface ofthe recess 151 (i.e., a top surface of the dielectric layer 150 d). Theprotection layer 160 may include, for example, silicon nitride, siliconoxynitride, or the like. The protection layer 160 may be formed usingatomic layer deposition (ALD), other suitable processes, or combinationsthereof.

As shown in FIG. 3 and FIG. 4, an anisotropic etching is performed toremove at least portions of the protection layer 160 on top surfaces ofthe dielectric layer 150 u and on the bottom surface of the recess 151(i.e., on the top surface of the dielectric layer 150 d) and a portionof the dielectric layer 150 d while the residual protection layer 160and a portion of the residual dielectric layer 150 d still cover thesidewalls of the recess 151 (i.e., the sidewalls of the dielectric layer150 u and the spacers 141 and 143). Therefore, the recess 151 isdeepened, and the source drain structure 130 is exposed by the deepenedrecess 151. In some embodiments, the anisotropic etching may be dryetching, such as reactive ion etching (RIE), plasma enhanced (PE)etching, or inductively coupled plasma (ICP) etching.

Reference is made to FIG. 4 and FIG. 5. A conductive layer 170 overfillsthe recess 151, such that a bottom conductor 171 is formed in the recess151 and the bottom conductor 171 is electrically connected to the sourcedrain structure 130. The conductive layer 170 is made of metal, such ascopper (Cu), aluminum (Al), tungsten (W), nickel (Ni), cobalt (Co),titanium (Ti), platinum (Pt), tantalum (Ta), or combinations thereof.The conductive layer 170 is formed by, for example, electrochemicaldeposition, physical vapor deposition (PVD), chemical vapor deposition(CVD), or combinations thereof.

Then, the dielectric layers 150 u, the upper portion of the protectionlayer 160 (the height of the upper portion of the protection layer 160is greater than the height of the gate structures 121 and 123 and theheight of the hard mask layers 145 and 147), and the upper portion ofthe conductive layer 170 (the height of the upper portion of theconductive layer 170 is greater than the height of the gate structures121 and 123 and the height of the hard mask layers 145 and 147), whichincludes the upper portion of the bottom conductor 171, are removedthrough a removal process. In some embodiments, the dielectric layer 150u, the protection layer 160, and the conductive layer 170 over burdenare removed by a chemical mechanical polishing (CMP) process. In someembodiments, when the conductive layer 170 is made of copper (Cu), theCMP slurry is made of, for example, a mixture of suspended abrasiveparticles, an oxidizer, and a corrosion inhibitor, and the CMP slurry isacidic. A two-step CMP process may be used to remove the excessdielectric layers 150 u, the protection layer 160, and the conductivelayer 170. In the first step, the abrasive will remove the conductivelayer 170 without disturbing the dielectric layers 150 u and theprotection layer 160. In the second step, the residual dielectric layers150 u, the protection layer 160, and the conductive layer 170 will beremoved using silica abrasive. After the CMP process, the protectionlayer 160 is present between the bottom conductor 171 and the spacer 141and between the bottom conductor 171 and the spacer 143.

Reference is made to FIG. 6. A dielectric layer 180 is formed on thegate structures 121 and 123, the protection layer 160, and the bottomconductor 171. The dielectric layer 180 is an interlayer dielectric(ILD) layer. The dielectric layer 180 is made of a dielectric material,such as silicon oxide, silicon nitride, silicon oxynitride, orcombinations thereof. In some embodiments, the dielectric layer 180 ismade of a low-κ dielectric material to improve resistive-capacitive (RC)delay. The dielectric constant of the low-κ dielectric material is lowerthan that of silicon dioxide (SiO₂). One approach to reduce thedielectric constant of a dielectric material is to introduce carbon (C)or fluorine (F) atoms. For example, in SiO₂ (κ=3.9), the introduction ofC atoms to form hydrogenated carbon-doped silicon oxide (SiCOH) (κ isbetween 2.7 and 3.3) and the introduction of F atoms to formfluorosilicate glass (FSG) (κ is between 3.5 and 3.9) reduces itsdielectric constant. In some embodiments, the low-κ dielectric materialis, for example, nanopore carbon doped oxide (CDO), black diamond (BD),a benzocyclobutene (BCB) based polymer, an aromatic (hydrocarbon)thermosetting polymer (ATP), hydrogen silsesquioxane (HSQ), methylsilsesquioxane (MSQ), poly-arylene ethers (PAE), diamond-like carbon(DLC) doped with nitrogen, or combinations thereof. The dielectric layer180 is formed by, for example, chemical vapor deposition (CVD), spincoating, or combinations thereof.

As shown in FIG. 6 and FIG. 7, an opening 181 is formed in thedielectric layer 180 to at least partially expose the protection layer160 and at least a portion of the bottom conductor 171. The opening 181is formed by a photolithography and etching process. In someembodiments, a layer of photoresist material (not shown) is formed overthe dielectric layer 180. The layer of photoresist material isirradiated (or exposed) in accordance with a pattern (the opening 181)and developed to remove a portion of the photoresist material. Theremaining photoresist material protects the underlying material fromsubsequent processing steps, such as etching. Then, an etching processis performed to form the opening 181.

Then, the protection layer 160 is removed, such that a gap 161 is formedbetween the bottom conductor 171 and the spacer 141 and between thebottom conductor 171 and the spacer 143. In other words, the gap 161 isformed between the bottom conductor 171 and the sidewall of the recess151. In some embodiments, a selective wet etching process, which is achemical etching process, may be performed to remove the protectionlayer 160. A wet etching solution includes a hot phosphoric acidsolution. The wet etching processes have etching parameters that can betuned, such as etchants used, etching temperature, etching solutionconcentration, etching pressure, etchant flow rate, and other suitableparameters.

In FIG. 8, a conductive layer 190 overfills the opening 181, and thenthe excess conductive layer 190 outside of the opening 181 is removed.The conductive layer 190 is made of metal, such as copper (Cu), aluminum(Al), tungsten (W), nickel (Ni), cobalt (Co), titanium (Ti), platinum(Pt), tantalum (Ta), or combinations thereof. The conductive layer 190is formed by, for example, electrochemical deposition, physical vapordeposition (PVD), chemical vapor deposition (CVD), or combinationsthereof.

The excess conductive layer 190 outside of the opening 181 is removedthrough a removal process. In some embodiments, the conductive layer 190over burden is removed by a chemical mechanical polishing (CMP) process.In some embodiments, when the conductive layer 190 is made of copper(Cu), the CMP slurry is made of, for example, a mixture of suspendedabrasive particles, an oxidizer, and a corrosion inhibitor, and the CMPslurry is acidic. After the CMP process, a upper conductor 191 (theconductive layer 190) is formed in the opening 181 of the dielectriclayer 180. The upper conductor 191 is electrically connected to thebottom conductor 171, and the upper conductor 191 is in direct contactwith at least one sidewall of the opening 181.

In another aspect of the present disclosure, as shown in FIG. 8, asemiconductor structure 100 is provided. The semiconductor structure 100includes a substrate 110, gate structures 121 and 123, spacers 141 and143, at least one source drain structure 130, and at least one conductor193. The gate structures 121 and 123 are present on the substrate 110.The spacer 141 is present on at least one sidewall of the gate structure121, and the spacer 143 is present on at least one sidewall of the gatestructure 123. The source drain structure 130 is present on thesubstrate 110 and adjacent to the spacers 141 and 143, and the sourcedrain structure 130 is present between the source drain structures 121and 123. The conductor 193 includes an upper conductor 191 and a bottomconductor 171. The bottom conductor 171 is electrically connected to thesource drain structure 130. The upper conductor 191 is electricallyconnected to the bottom conductor 171. The bottom conductor 171 has anupper portion and a lower portion between the upper portion and thesource drain structure 130, and a gap 161 is at least present betweenthe upper portion of the bottom conductor 171 and the gate structure 121and between the upper portion of the bottom conductor 171 and the gatestructure 123. The upper conductor 191 covers the gap 161.

The semiconductor structure 100 further includes a dielectric layer 180.The dielectric layer 180 is present at least on one of the gatestructures 121 and 123 and has an opening 181 therein. The source drainstructure 130 is exposed through the opening 181, and at least a portionof the upper conductor 191 is present in the opening 181. The upperconductor 191 is in direct contact with at least one sidewall of theopening 181. Additionally, at least portions of the spacers 141 and 143are exposed through the opening 181, and the gap 161 exists between thebottom conductor 171 and the portions of the spacers 141 and 143 exposedby the opening 181.

The semiconductor structure 100 further includes a dielectric layer 150d. The dielectric layer 150 d is present between the lower portion ofthe bottom conductor 171 and the spacer 141 (or the gate structure 121)and between the lower portion of the bottom conductor 171 and the spacer143 (or the gate structure 123). The gap 161 exists above the dielectriclayer 150 d. That is, the dielectric layer 150 d is present between thegap 161 and the source drain structure 130.

Specifically, the height of the dielectric layer 150 d is in a rangefrom about 5 nm to 1000 nm (i.e., the distance between the top surfaceand the bottom surface of the dielectric layer 150 d), and the width ofthe dielectric layer 150 d is in a range from about 5 Å to about 100 Å(i.e., the distance between the two side surfaces of dielectric layer150 d). Embodiments of this disclosure are not limited thereto. Theperson having ordinary skill in the art can make proper modifications tothe dielectric layer 150 d depending on the actual application.

The semiconductor structure 100 further includes a hard mask layer 145present on a top surface of the gate structure 121 and a hard mask layer147 present on a top surface of the gate structure 123. In other words,the hard mask layer 145 is present between the gate structure 121 andthe dielectric layer 180, and the hard mask layer 147 is present betweenthe gate structure 123 and the dielectric layer 180.

The gap 161 may have gas therein. In other words, the gap 161 may begas-filled. Embodiments of this disclosure are not limited thereto. Theperson having ordinary skill in the art can make proper modifications tothe gap 161 depending on the actual application.

The source drain structure 130 may include at least one source drainstressor. Embodiments of this disclosure are not limited thereto. Theperson having ordinary skill in the art can make proper modifications tothe source drain structure 130 depending on the actual application.

Since the upper conductor 191 and the bottom conductor 171 are formed indifferent operations, the upper conductor 191 can be in direct contactwith at least one sidewall of the opening 181. In other words, the upperconductor 191 is in direct contact with the dielectric layer 180.Therefore, there is no other component present between the upperconductor 191 and the dielectric layer 180, so the width of theconductor 193 can be greater.

Reference is made to FIG. 9. In some embodiments, after the anisotropicetching shown in FIG. 4, the conductive layer 170 overfills the recess151. Then, the upper portion of the conductive layer 170 above thedielectric layer 150 u is removed through a removal process. In someembodiments, the conductive layer 170 over burden is removed by achemical mechanical polishing (CMP) process. In some embodiments, whenthe conductive layer 170 is made of copper (Cu), the CMP slurry is madeof, for example, a mixture of suspended abrasive particles, an oxidizer,and a corrosion inhibitor, and the CMP slurry is acidic. After the CMPprocess, a bottom conductor 172 (the conductive layer 170) is formed inthe recess 151.

Reference is made to FIG. 10. A portion of the dielectric layer 150 u isetched back to at least partially expose the protection layer 160. Theetching of the dielectric layer 150 u may be dry etching, such asreactive ion etching (RIE), plasma enhanced (PE) etching, or inductivelycoupled plasma (ICP) etching. In some embodiments, when the dielectriclayer 150 u is made of silicon oxide, fluorine-based RIE can be used toetch back the dielectric layer 150 u. The gas etchant used to dry etchthe dielectric layer 150 u is, for example, CF₄/O₂.

Reference is made to FIG. 10 and FIG. 11. The protection layer 160 isremoved, such that a gap 161 is present between the bottom conductor 172and the spacer 141 and between the bottom conductor 172 and the spacer143. The dielectric layer 150 u has an opening 152 therein, which is apart of the recess 151, and at least a part of the upper portion of thebottom conductor 172 is present in the opening 152. In some embodiments,a selective wet etching process, which is a chemical etching process,may be performed to remove the protection layer 160. A wet etchingsolution includes a hot phosphoric acid solution. The wet etchingprocesses have etching parameters that can be tuned, such as etchantsused, etching temperature, etching solution concentration, etchingpressure, etchant flow rate, and other suitable parameters.

In another aspect of the present disclosure, as shown in FIG. 11, asemiconductor structure 101 is provided. The semiconductor structure 101is similar to the semiconductor structure 100 of FIG. 8, and thedifference between the semiconductor structure 100 of FIG. 11 and thesemiconductor structure 100 of FIG. 8 is that the gap 161 of FIG. 11 isfurther present between the upper portion of the bottom conductor 172and at least one sidewall of the opening 152.

The protection layer 160 can protect the spacers 141 and 143 from beingover-etched during the deepening the recess 151. With the protectionlayer 160, the device size can be further reduced without putting aheavy load on the photolithography and etching process, and thus thedevice performance can be improved. Furthermore, the overlay and patternloading requirements can be loosened. In addition, the protection layer160 can enlarge the process window for contact hole formation andimprove in-line control in the semiconductor device fabrication process.Therefore, the reliability and/or the yield in fabricating thesemiconductor devices can be improved. After formation of the bottomconductor 171/172, the protection layer 160 can be removed to reduceparasitic capacitance and thus further enhance the device performance.

According to some embodiments of the present disclosure, a method formanufacturing a semiconductor structure includes forming a firstdielectric layer on a gate structure and a source drain structure. Arecess is formed at least partially in the first dielectric layer. Aprotection layer is formed at least on a sidewall of the recess. Therecess is deepened to expose the source drain structure. A bottomconductor is formed in the recess and is electrically connected to thesource drain structure. The protection layer is removed to form a gapbetween the bottom conductor and the sidewall of the recess.

According to some embodiments of the present disclosure, a method formanufacturing a semiconductor structure includes forming a first openingin a first dielectric layer to expose a source drain structure. A bottomconductor is formed in the first opening such that the bottom conductoris electrically connected to the source drain structure. A gap is formedaround the bottom conductor. An upper conductor is formed on the bottomconductor and is formed to cap a top opening of the gap.

According to some embodiments of the present disclosure, a method formanufacturing a semiconductor structure includes forming a firstdielectric layer on a gate structure and a source drain structure. Arecess is formed at least partially in the first dielectric layer. Aprotection layer is formed at least on a sidewall of the recess. Therecess is deepened to expose the source drain structure. A conductivematerial is overfilled in the recess. The conductive material, theprotection layer, and the first dielectric layer above the gatestructure are removed.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method for manufacturing a semiconductorstructure, the method comprising: forming a first dielectric layer on agate structure and a source drain structure; forming a recess at leastpartially in the first dielectric layer; forming a protection layer atleast on a sidewall of the recess; deepening the recess to expose thesource drain structure; forming a bottom conductor in the recess,wherein: the bottom conductor is electrically connected to the sourcedrain structure, and forming the bottom conductor comprises: overfillinga conductive material in the recess; and removing the conductivematerial and the first dielectric layer above the gate structure; andforming a second dielectric layer on the gate structure; forming anopening in the second dielectric layer to expose the bottom conductorand the protection layer; and removing the protection layer through theopening to form a gap between the bottom conductor and the sidewall ofthe recess.
 2. The method of claim 1, wherein the recess is deepenedsuch that a portion of the first dielectric layer is left on thesidewall of the recess.
 3. The method of claim 2, wherein the portion ofthe first dielectric layer left on the sidewall of the recess is betweenthe gap and the source drain structure after the protection layer isremoved.
 4. The method of claim 1, further comprising: forming an upperconductor in the opening, wherein the upper conductor is electricallyconnected to the bottom conductor.
 5. The method of claim 1, wherein:the protection layer is further formed on a bottom surface of therecess, and deepening the recess comprises: removing a portion of theprotection layer on the bottom surface of the recess.
 6. The method ofclaim 1, further comprising: forming an upper conductor in the opening,wherein the upper conductor is formed to cap a top opening of the gap.7. The method of claim 1, wherein: a hard mask is over the gatestructure, and the method further comprises: after deepening the recess,removing a portion of the first dielectric layer over the hard mask toexpose the hard mask.
 8. The method of claim 1, further comprising:forming the source drain structure above a substrate.
 9. The method ofclaim 8, wherein forming the source drain structure comprises formingthe source drain structure to contact a sidewall of a spacer adjacent tothe gate structure.
 10. The method of claim 1, wherein forming therecess comprises etching a spacer adjacent to the gate structure to forma tapered sidewall.
 11. The method of claim 10, wherein forming theprotection layer comprises forming the protection layer to contact thetapered sidewall of the spacer.
 12. A method for manufacturing asemiconductor structure, the method comprising: forming a first openingin a first dielectric layer to expose a source drain structure; forminga protection layer on a sidewall of the first opening; forming a bottomconductor in the first opening such that the bottom conductor iselectrically connected to the source drain structure; forming a seconddielectric layer on the bottom conductor and the protection layer;forming a second opening in the second dielectric layer to expose a topsurface of the bottom conductor and a top surface the protection layer;forming a gap around the bottom conductor by removing the protectionlayer through the second opening; and forming an upper conductor on thebottom conductor, wherein the upper conductor is formed to cap a topopening of the gap.
 13. The method of claim 12, wherein forming theupper conductor comprising: overfilling a conductive material in thesecond opening; and removing a portion of the conductive materialexceeding the second opening.
 14. The method of claim 12, wherein theprotection layer comprises a nitride material.
 15. The method of claim12, wherein the first dielectric layer comprises a low-K dielectricmaterial.
 16. A method for manufacturing a semiconductor structure, themethod comprising: forming a first opening in a first dielectric layerto expose a source drain structure; forming a protection layer on asidewall of the first opening, wherein the first dielectric layer has aportion surrounding the protection layer; forming a bottom conductor inthe first opening such that the bottom conductor is electricallyconnected to the source drain structure; etching back the portion of thefirst dielectric layer surrounding the protection layer to expose atleast a portion of a sidewall of the protection layer; forming a gaparound the bottom conductor by removing the protection layer; andforming an upper conductor on the bottom conductor, wherein the upperconductor is formed to cap a top opening of the gap.
 17. The method ofclaim 16, wherein the protection layer comprises a nitride material. 18.The method of claim 16, wherein the first dielectric layer comprises alow-K dielectric material.
 19. The method of claim 16, wherein formingthe gap comprises forming the gap to expose the first dielectric layer.20. The method of claim 16, wherein etching back the portion of thefirst dielectric layer comprises etching back the portion of the firstdielectric layer such that a top surface of the bottom conductor isabove a top surface of the first dielectric layer.